Product introduction:
A9 dispensing system has obvious advantages of high cost performance, reliability, durability and simplified design. It is suitable for multi specification circuit boards and substrates. It is equipped with simple and friendly operation software to ensure the stability and reliability of the system. The system is designed for dispensing applications of chip packaging, red glue, circuit board assembly, medical supplies and other products. The track can adjust the width and is widely used. Y & D has established an extensive support and service network throughout the country to provide complete process solutions for customer development, manufacturing and product innovation.
Application Industry:
Bottom filling, red glue, silver paste, encapsulation, surface mounting, precision coating, semiconductor chip packaging, dam & fill, etc.
Features and advantages:
High cost performance with high performance
The non-contact injection valve realizes smaller dispensing diameter, so as to broaden a wider application field
Injection valve improves dispensing reliability, consistency, productivity and yield
Mature and stable high-speed motion platform
The minimum underfill overflow width is only 0.2mm (related to configuration and glue)
Identify the chip body, which is more accurate than mark point identification and positioning
Identification, automatic program call, fool proof, data statistics and other functions to realize intelligent manufacturing
Technical parameters:
| Dimension | L860*W1300*H1550mm | Vacuum cleaning device | |
| Dispensing area | 340x500mm | Non-contact jet valve JET6000 | |
| Max acceleration | Max:1.0g | 30cc and 55cc material supply device | |
| locating accuracy | ±0.02(XYZ) | Acoustic and visual alarm | |
| Repeatability | ±0.02(XYZ) | Sprayer heating device | |
| Softward | Standard operating softward | Single-track | |
| Vision sense | German high-definition digital CCD camera | X-,Y-and Z- axis daturn point calibration platform |

